At productronica in Munich, Germany, taking place from November 14 to 17, 2023, Viscom AG will present for the first time its latest high-end iS6059 Double-Sided Inspection system. At Viscom’s Booth A2.177, visitors to the world’s leading trade fair for electronics manufacturing can learn more about the advantages of simultaneous optical assembly inspection from above and below using the new machine’s special features.
The iS6059 Double-Sided Inspection is equipped with two state-of-the-art sensor heads that capture images and 3D height information on separate positioning units to reliably find top and bottom side defects. Through-hole technology (THT) is still needed and used in the areas of electric vehicles, charging infrastructures and renewable energies due to high current flows. In addition to inspecting components topside, the bottom side must also be critically examined to determine whether a pin is missing or if there is insufficient solder. Components pressed in without soldering (press-fit) can also be accurately inspected. Pin lengths, for example, are precisely measured and displayed in profiles.
Another area of application for the iS6059 Double-Sided Inspection involves various applications from the field of automotive electronics with double-sided SMD assembly. For example, one assembled side passes through the soldering process, is then turned over, and must remain fully intact during a re-melting of the solder joints in the oven – all while the second side is soldered after its assembly. The iS6059 Double-Sided Inspection then reliably inspects both sides.
Like other Viscom systems, the iS6059 Double-Sided Inspection can be comprehensively networked. In this context, visitors to the company’s trade fair stand can expect to see various vConnect features. This future-oriented modular platform from Viscom has a lot to offer – from location-independent predictive maintenance to cloud solutions and centrally controlled IT services as well as statistical process control. Other Viscom inspection systems that will be on display at productronica include: iS6059 PCB Inspection Plus (3D AOI), iX7059 PCB Inspection XL (3D AXI), X8011-III (3D MXI), X7056-II (3D AOI and 3D AXI combined) and S6053BO-V (3D Bond). The topics of inspection program generation and verification using artificial intelligence are on the agenda at Viscom too – as are solder paste (SPI) and conformal coating inspection (CCI).
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