Nordson Presents Top Inspection and Metrology Systems at APEX 2023

Nordson Presents Top Inspection and Metrology Systems at APEX 2023

Nordson Test & Inspection revealed that it will participate in the 2023 IPC APEX EXPO, which will be held at the San Diego Convention Center in California from January 24-26, 2023. In Booth #915, the business will feature the multi-award-winning CyberOptics SQ3000TM+ Multi-Function system for AOI, SPI, and CMM, the M2 AOI system, the CyberOptics SE3000TM SPI system, and the Quadra 7 X-ray system.

With an even higher resolution Multi-Reflection Suppression® (MRS®) sensor that prevents reflection-based distortions brought on by shiny components and specular surfaces, the CyberOptics SQ3000+ all-in-one solution for AOI, SPI, and CMM offers an unmatched combination of high accuracy and high speed. The system is especially made for high-end tasks like socket metrology, 008004/0201 SPI, advanced SMT, mini-LED, advanced packaging, and other difficult CMM tasks.

Using cutting-edge megapixel technology, the M2 AOI system provides high-speed inspection and outstanding flaw coverage. The M2 offers thorough examination for wire bonds, die placement, SMT components, and substrates thanks to resolutions and telecentric optics.

With one mode for high-speed inspection and another mode for high resolution examination, the new Dual-Mode MRS sensor in the CyberOptics SE3000TM SPI system offers the most versatility for applications specifically designed for solder paste inspection. The new sensor is an addition to the exclusive MRS sensor line, which offers market-leading performance in the semiconductor and SMT sectors. The SE3000 is excellent for determining height, area, volume, registration, and bridging as well as identifying insufficient paste, excessive height, smear, offset, and other issues.

The Quadra 7 X-ray system will also be displayed by the business. With the best image quality and magnification, Quadra 7 is at the forefront of X-ray inspection performance, displaying characteristics and flaws as small as 0.1 mm without causing any damage. Suitable for wafer level components including TSV and wafer bumps, wire bond integrity verification, component cracking, and MEMs inspection. Across a variety of industries, including electronics packaging and wafer level manufacturing, automotive, energy, and aerospace electronics inspection, as well as medical device and LED fabrication, Quadra 7 is the go-to X-ray inspection and failure analysis tool.

Click on the following link Metrologically Speaking to read more such news on metrology.

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