Wall thickness measurement on machine tools now available for wet applications

Wall thickness measurement on machine tools now available for wet applications

Hexagon’s Manufacturing Intelligence division has enhanced its ground-breaking ultrasonic probe for automated wall thickness measurement on machine tools with the launch of two new versions designed for wet machining.

Ultrasonic probe for automated wall thickness measurement

An innovative ultrasonic touch probe from Hexagon for measuring thickness directly on the machine tool, the RWP20.50-G-UTP has secured success for significantly reducing inspection times and enhancing data capture for dry applications. Now in response to high customer demand, Hexagon has developed a new version of the RWP20.50-G-UTP that can measure wall thickness even when parts are produced with lubricants and coolants.

Inspecting the thickness of a part’s walls is typically a time-consuming manual process that takes place off the machine tool, resulting in downtime. The RWP20.50-G-UTP touch probe from Hexagon transforms the procedure by using ultrasound to automatically measure wall thickness within the machine tool installation.

Until now, however, it has only been possible to use an ultrasonic sensor to measure the wall thickness of parts with dry coupling. Hexagon’s new sensor options for wet coupling not only saves time by enabling operators to take automated measurements directly on the machine tool, it also reduces spending on materials by using the coolant liquid of the machine as a coupling fluid. 

Hexagon’s RWP20.50-G-UTP probe offers a choice of sensor heads adapted to different customer requirements and applications. For wet machining, customers can opt for a sensor head with a measurement range of either 0.7 – 9 mm or 1.5 – 30 mm. For dry applications that do not require a coupling fluid, the sensor measurement range is 0.7 – 9 mm..

To know more, check Hexagon

Share

Written by:

1,476 Posts

View All Posts
Follow Me :

Leave a Reply

Your email address will not be published. Required fields are marked *